Because HBMs allow RAM dies to be smaller, the technology can help with the development of thinner iPhone models or variants of the iPhone with larger battery cells to generate longer battery life. Additionally, connecting mobile HBM to the GPU for the iPhone 20 Pro models could allow large language models (LLM) to run on-device without consuming too much battery life or raising the phone’s latency.
The tech giant’s suppliers of memory components, Samsung and SK Hynix, are already developing their own versions of the technology, and both will undergo mass production starting next year. Samsung will be using a packaging method called Vertical Cu-post Stack (VCS), while SK Hynix is using a method called Vertical Wire Fan-Out (VFO). The only downside to using this technology is its cost, as it is expensive and could give Apple a reason to jack up prices in 2027 besides the expected new glass slab design.
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